|
Views: 55
Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Muhannad & James) 528 pages | Sep 22 2010 |ISBN: 596932465 | PDF | 11.60 MB Make way for solutions to the challenges in chip reliability, power delivery, I/O signaling, and heat removal now blocking the way to ultimate performance 3D gigascale SoC. |




